Products
Silicon-on-Insulator (SOI) Wafers
Overview
Silicon-on-Insulator (SOI) wafers are a cutting-edge technology in the semiconductor industry, designed to enhance the performance of electronic devices by reducing parasitic device capacitance, improving speed, and decreasing power consumption. At STAAR LLC, we offer premium SOI wafers tailored to meet the exacting standards of modern semiconductor applications.
Product Features
Enhanced Performance
SOI wafers significantly reduce parasitic capacitance, resulting in faster switching speeds and lower power consumption.
Thermal Isolation
The insulating layer provides excellent thermal isolation, improving device performance and reliability.
Improved Yield
Reduced leakage current and enhanced isolation lead to higher device yields in manufacturing.
Partially Depleted SOI (PDSOI):
- Description: Ideal for high-speed and low-power applications, PDSOI wafers offer significant performance improvements over bulk silicon wafers.
- Applications: Used in high-performance processors, RF circuits, and power management devices.
Fully Depleted SOI (FDSOI):
- Description: FDSOI wafers provide even greater performance enhancements, with lower power consumption and higher speed, due to the fully depleted silicon layer.
- Applications: Suitable for advanced logic circuits, mobile processors, and high-speed communication devices.
Smart Cut SOI:
- Description: Manufactured using the Smart Cut™ technology, these wafers offer precise control over the thickness of the silicon and insulator layers.
- Applications: Used in applications requiring ultra-thin layers, such as advanced MEMS devices and high-frequency circuits.
- Diameter: Available in various diameters from 100mm to 300mm.
- Top Silicon Layer Thickness: Customizable from a few nanometers to several micrometers, depending on application requirements.
- Buried Oxide (BOX) Layer Thickness: Typically ranges from 100nm to 3μm, providing the necessary insulation for specific device needs.
- Silicon Orientation: Options include (100), (110), and (111) orientations.
- Resistivity: Available in a wide range to meet diverse electrical specifications.
- High-Performance Microprocessors: Enhances speed and reduces power consumption in advanced CPUs and GPUs.
- RF and Analog Devices: Provides superior performance for RF circuits, reducing noise and improving signal integrity.
- Power Management ICs: Improves efficiency and performance in power management and power conversion applications.
- MEMS Devices: Ideal for micro-electro-mechanical systems, including sensors and actuators, due to the excellent thermal and electrical isolation.